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As electronic products become smaller, the components used in them are also getting tinier, which means that the processing environment for surface mount technology (SMT) chips must also be highly controlled. This has led to a need for stricter requirements for SMT chip processing. Apart from strictly regulating the process flow, efficient SMT patch factories also need to control the environment of the SMT workshop and understand certain precautions.
Here are some environmental requirements for SMT patch processing workshops:
SMT patch production equipment is high-precision mechatronics equipment, and it has certain requirements for the cleanliness, humidity, and temperature of the environment. Generally, single-phase AC220 (220±10%, 0/60Hz) and three-phase AC380 (380±10%, 50/60Hz) are required. The power supply should be more than twice the power consumption.
Reflow soldering and wave soldering equipment need to be equipped with exhaust fans. For all hot blast furnaces, the minimum flow rate of the exhaust duct is 500 cubic feet/minute (14.15m3/min).
Requirements For SMT Patch Processing
The production workshop's ambient temperature is 23±3 degrees Celsius, generally ranging between 17~28 degrees Celsius. The relative humidity should be maintained between 45%~70%RH. A suitable temperature and humidity meter is installed for regular monitoring, and temperature adjustment and humidity facilities are provided according to the workshop's size.
The air source's pressure should be configured according to the equipment requirements. Either the factory's air source can be used, or a separate oil-free compressed air machine can be configured. The pressure should be greater than 7kg/cm2. Purified air that is clean and dry is required, so the compressed air needs to be de-oiled, de-dusted, and treated for water. Air ducts should be made of stainless steel or pressure-resistant plastic pipes.
Workers must wear anti-static clothing, shoes, and anti-static bracelets to enter the workshop. The anti-static work area should be equipped with an anti-static floor, anti-static seat cushion, anti-static packaging bag, turnover box, PCB rack, etc.
SMT Patch Processing Matters Need Attention
If you have just purchased solder paste, refrigerate it if it is not going to be used immediately. The temperature should be maintained between 5 degrees Celsius-10 degrees Celsius, not lower than 0 degrees Celsius. There is a lot of information on the Internet about stirring and using solder paste, but not much introduction.
During the placement process, due to the placement machine equipment's aging and the suction nozzle and feeder's damage, the placement of the placement machine tends to be crooked, causing high throwing. This reduces production efficiency and increases production costs. In the case of machine equipment, it is necessary to carefully check whether the suction nozzle is blocked or damaged and whether the feeder is intact.
The quality of PCB circuit board soldering has a great relationship with the reflow soldering process's reasonable setting of process parameters. Generally, the furnace temperature test should be performed twice a day, and the minimum test should be conducted once a day to continuously improve the temperature curve and set the temperature curve that best fits the welding product. Do not miss this link for the sake of production efficiency and cost savings.
Why Choose China PCBA Supplier KSPCBA as Your SMT Patch Processing Manufacturer?
– Experienced and skilled team
– State-of-the-art equipment
– Strict quality control
– Excellent customer service
– Competitive price